# Hanbang Hua

> Hardware engineer at Nokia working on RF linearization algorithms for next-generation wireless systems. M.S. in Electrical Engineering from Northwestern University and B.A. in Physics from UC Berkeley, with research in 2D materials and wearable bioelectronics.

## Pages

- [Home](https://hanbanghua.com/): Hanbang Hua, hardware engineer at Nokia.
- [About](https://hanbanghua.com/aboutme/): Background and journey: UC Davis (2019–2021), UC Berkeley B.A. Physics and the Ultrafast Nano-Optics Group (2021–2023), Northwestern M.S. Electrical Engineering and bioelectronics research (2023–2025), Nokia (2025–present). Mountaineer with 20+ summits and 23 US national parks visited.
- [Projects](https://hanbanghua.com/projects/): Research and engineering projects.
- [Travel](https://hanbanghua.com/travel/): Map and timeline of 23 US national parks and other places visited since 2021, with photos.
- [Contact](https://hanbanghua.com/contact/): Contact form and email.

## Projects

- [Electrical Transport with RuCl₃](https://hanbanghua.com/projects/?project=berkeley): Low-resistance RuCl₃-doped graphene contacts for electrical transport measurements in monolayer WS₂ and MoSe₂ (Ultrafast Nano-Optics Group, UC Berkeley).
- [Wireless NIRS Pediatric Platform](https://hanbanghua.com/projects/?project=northwestern): A wireless near-infrared spectroscopy health-sensing platform; cut power consumption by 80% and form factor by 50% (Querrey Simpson Institute for Bioelectronics, Northwestern University).
- [RF Linearization Algorithms](https://hanbanghua.com/projects/?project=nokia): RF linearization for next-generation wireless systems at Nokia.

## Contact

- Email: victorhua26@gmail.com
- LinkedIn: https://www.linkedin.com/in/hanbang-hua-04667515a/