Hua Studio

About Me

Hanbang Hua

I'm a hardware engineer at Nokia, developing RF linearization algorithms for next-generation wireless systems. My work spans the full stack — from algorithm design to hardware development. I've built multi-layer controlled-impedance PCBs, and written scripts in Rust and Python for wearable medical devices.

I hold a Master's in Electrical Engineering from Northwestern University and a Bachelor's in Physics from UC Berkeley, where I spent two years as an undergraduate researcher at the Ultrafast Nano-Optics Group investigating 2D materials — graphene, hBN, and transition metal dichalcogenides. At Northwestern's Querrey Simpson Institute for Bioelectronics, I led development of a wireless NIRS health-sensing platform, cutting power consumption by 80% and reducing form factor by 50%.

Outside the lab, I'm a mountaineer with 20+ summits and have explored 23 national parks across the US. I believe the same mindset that gets you up a mountain — preparation, patience, and timing — applies directly to engineering.

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0 Electronics Devices Soldered
0 National Parks Visited
0 Mountain Summits Reached

Journey

2019 – 2021
UC Davis
Explored astrophysics and ODMR spectroscopy
2021 – 2023
UC Berkeley
B.A. Physics · Ultrafast Nano-Optics Group
2023 – 2025
Northwestern University
M.S. Electrical Engineering · Bioelectronics Research
2025 – Now
Nokia
Hardware Engineer · RF Linearization